 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ZMD-Standard March 1997 1. Amendment November 1997 Package SOP32 (300 mil) MDS 745 Dimensions in millimetres Based on JEDEC: JEP95 MO-119 1 Dimensions A2 A X View X 0,1 k x 45 32 A1 1 Z e D bp 0,2 M Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2,54 0,36 0,51 1,27 10,29 10,64 0,53 0,91 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* 2,29 0,102 0,254 2,18 2,29 0,15 0,32 20,57 20,88 7,42 7,60 0,25 0 8 * without mold-flash 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,91 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends Emin* Emax* kmin min max Zentrum Mikroelektronik Dresden Editor: signed Schoder Check: signed Marx Date: 27.03.1997 Quality: signed Lorenz Doc-No. QS-000745-HD-01 c LP |
Price & Availability of MDS745
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |